Architectural cleanroom layout, 92+ equipment engineering taxonomy, cascading process yield simulation, and SEMI E10 equipment telemetry.
Bridging physical cleanroom architecture with microscopic semiconductor physics in an open digital framework.
Instant toggle between architectural 2D floor plans and high-precision 3D cleanroom digital twin with raised perforated flooring and amber lithography core.
Accurate physical dimensions (W×L×H) and elevation drawings for leading brands: ASML, Lam, AMAT, TEL, KLA, Screen, and DISCO.
Surrogate physics model linking material purity, equipment aging, and inter-step queue times into real-time Fab yield and monthly capacity.
SEMI E10 equipment operational state machine (Running, Idle, Down, Maintenance) with live sensor sparklines and fault injection scenarios.
Integrating open-source industrial tools, SEMI communication protocols, and physics-based models into an open semiconductor digital ecosystem.
ISA-95 Level 3 execution with SEMI E40/E87/E90/E94 standards, FOUP carrier tracking, and automated fab dispatching.
Shewhart control charts, Nelson 8 run rules, real-time Cp/Cpk capability, and chamber sensor fault detection.
WM-811K benchmark defect patterns, 300mm die bin maps, STDF V4 datalog parsing, and Poisson/Murphy yield models.
Test Edge-Ring, Center, Scratch, and Donut defect fingerprints, observe theoretical Poisson vs. Murphy yield calculations, and inspect STDF logs.